Having professional test platform, advanced test system and capability, including pre-test requirement assessment, test program development, test platform conversion, machine comparison, engineering verification, mass production,  OQC(Outgoing Quality Control), packing, delivery, test data integration and so on.

On the one hand, HSTS provides different processes such as CP1,CP2 and CP3 in the wafer sort. On the other hand, we provide high temperature baking and other services to satisfy the testing requirements of different products and different customers.

HSTS provides varieties of test platform to customers. Prober currently supports testing on 8 – and 12-inch wafers. The clean room can reach class 100 and Class 1000, which can satisfy the wafer sort needs of different types of products.

HSTS possess of advanced probe card maintenance and repair ability, can provide customers  professional probe card maintenance service quickly and timely, Can help customers save time, improve production capacity.

HSTS is dedicated to 8 “, 12 “chip probing and final test for memory, automotive electronics, photography, Bluetooth, fingerprint, sensors and other fields. The products of the service are:

CMOS Image Sensor

Memory

TOF AR/VR

MCU/Controller

RF

Finger Print