HSTS provide CMOS image sensor RW and assembly.

which is covering the product types such as 8-inch, 12-inch CIS Reconstruct Wafer (wafer grinding/laser grooving/Die saw/Die sort), leadless image sensor assembly(CLCC/PLCC/TINY PLCC) .

HSTS devotes to improving product yield rate and product quality use the benchmark RW and assembly equipment what has high sophisticated and high stability superiority while matches with cleaning and AOI equipments,which not only supports single unit product also panel array process,and maintains its efficiency.

HSTS has solid product structure design scheme to improve the reliability of assembly products. The products reliability of CLCC can be up to MSL-1a, PLCC to MSL-3,TINY PLCC to MSL-4.

HSTS has efficient dust-free cleanroom environment reaching class 10 and class 100, which can achieve the assembly requirements of different grades of products.

The products of service are:
CMOS Image Sensor
TOF AR/VR device
IR sensor
Finger print